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Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
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Episil Technologies Inc.
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Manufacturer of silicon epitaxial wafers foundry and provide buried layer epitaxial process services.
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PVA TePla AG
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Providers of microwave plasma tools for ashing, resist strip, descum, polyimide and paralyne removal, surface cleaning and isotropic etch processing for semiconductor wafers, flat panel displays , mems and optoelectronics.
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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Micro-Mechanics
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Manufactures a range of tooling, precision parts, and consumable materials for the semiconductor, fiber-optic, and micro-electronic industries.
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Mattson Technology, Inc.
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Designs, manufactures and markets advanced fabrication equipment used in semiconductor manufacturing. (Nasdaq: MTSN).
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