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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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Intellemetrics
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Provides a range of thin film process control instrumentation including quartz crystal monitors, plasma monitors, optical monitors, and laser end point detectors.
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Diamond Touch Technology
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Engineers and manufactures dicing saws. Site includes product photos and specifications, and lists of current customers and authorized sales agents.
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Maludai Technology Corp.
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Manufacturers embossed carrier tape, heat sealing type cover tape, plastic reel and taping machine for 12mm to 56mm carrier tape.
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Yield Dynamics, Inc.
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Yield management and process control solutions for the semiconductor industry.
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