|
Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
| 1. |
RD Automation Flip Chip Die bonders
|
|
|
Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
|
| 3. |
MKS Instruments, Inc.
|
|
|
Supplies instruments and components used to measure, control, analyze and isolate gases in semiconductor and other manufacturing processes. (Nasdaq: MKSI).
|
| 5. |
Planar Concern
|
|
|
Research and manufacturing of semiconductor equipment including photolithography machines, photomasks, mask aligners, dicing saws, and die bonders.
|
|
|