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ULTRA t Equipment
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Provide cleaning systems for the semiconductor industry and microelectronics industries, meeting the most stringent requirements for a broad range of substrates.
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Branchy Technology Co., Ltd
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Manufacture of thin-film process equipments for semiconductor, optoelectronic, and communication devices. The major products are physical vapor deposition systems such as thermal coater, e-beam evaporator, sputtering system and plasma-series equipments.
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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Episil Technologies Inc.
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Manufacturer of silicon epitaxial wafers foundry and provide buried layer epitaxial process services.
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