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Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
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Keko Equipment
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Manufacturer of equipment for development of multilayer based components.
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BTU International, Inc.
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Provides thermal process solutions for the electronic assembly and semiconductor packaging markets, develops custom equipment for specialty applications needing high-temperature and atmosphere-control. (Nasdaq: BTUI).
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BE Semiconductor Industries NV
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Designs, develops, manufactures, markets and services molding, trim and form, and selective plating and tin-lead plating equipment for the semiconductor industry's back-end assembly operations. (Nasdaq: BESI).
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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