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Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
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MAT-VAC Technology,Inc.
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Supplier of high purity materials (sputter targets, evaporation sources) for thin film deposition; remanufactured sputtering and evaporation equipment: replacement parts; sputtering accessories including sputtering cathode.
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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GT Equipment Technologies Inc.
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Manufacture of semi-custom and specialty equipment for the materials processing industries. Supplier to the global semiconductor and photovoltaic industries.
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