RD Automation Flip Chip Die bonders
Link ID 87243
Title RD Automation Flip Chip Die bonders
Url http://www.rdautomation.com
Description Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
Category Electronics and Electrical > Components > Semiconductors > Tools and Equipment
Keywords
Date Jul 19, 2006
Contact Name
Email
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