RD Automation Flip Chip Die bonders
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Link ID |
87243 |
Title |
RD Automation Flip Chip Die bonders |
Url |
http://www.rdautomation.com |
Description |
Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available. |
Category |
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Keywords |
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Date |
Jul 19, 2006 |
Contact Name |
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Email |
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