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Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
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Frontier Semiconductor Inc.
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Manufacturer of equipment for measuring deposited thin film flatness and stress in wafers and characterizing wafer adhesion materials. Site includes product descriptions and a description of how wafer stress is measured.
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King Yuan Electronics Co.
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A service provider in mixed, logic and memory testing and assembly, providing turnkey solutions that include wafer sort, packaging, testing, burn-in and drop ship. From Taiwan.
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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