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Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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Accretech Ltd.
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Specialized in the field of image processing, machine control and algorithm development for inspection tools for wafer inspection and mask inspection tools.
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Micro-Mechanics
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Manufactures a range of tooling, precision parts, and consumable materials for the semiconductor, fiber-optic, and micro-electronic industries.
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Disco Corporation
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Manufacturer of precision dicing saws and grinding wheels providing dicing, grinding, and polishing equipment and services for semiconductor and electronic components.
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