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Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
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Suss Microtec
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Manufacturer of mask aligners, bonders, flip chip bonders, spin coaters and probe systems for the mems, advanced packaging for the semiconductor markets.
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DuPont
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Manufacturer of dry film photoresists for wafer bumping for Micro Electro Mechanical Systems (MEMS).
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Thermonics Incorporated
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Manufactures precision temperature forcing systems, temperature chuck systems, automatic tri-temperature robotic handlers, and custom thermal fixturing for the IC industry.
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Epitaxial Technologies, LLC
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Manufactures compound semiconductors and value-added wafer products for the rapidly expanding wireless and optoelectronic industries.
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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