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Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
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Surface Technology Systems plc (STS)
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Manufacturer of plasma etch and deposition equipment for micro electromechanical systems (MEMS), photonics, wireless and data storage semiconductor applications.
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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EV Group
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Manufacturer of semiconductor production equipment. Including ranges for resist processing, wafer cleaning, wafer bonding and SOI bonding.
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PVA TePla AG
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Providers of microwave plasma tools for ashing, resist strip, descum, polyimide and paralyne removal, surface cleaning and isotropic etch processing for semiconductor wafers, flat panel displays , mems and optoelectronics.
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