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Disco Corporation
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Manufacturer of precision dicing saws and grinding wheels providing dicing, grinding, and polishing equipment and services for semiconductor and electronic components.
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Orbis Technologies Ltd
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Providers of plasma coating, etching, ashing and metallization products. Applications include semiconductor manufacturing.
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Electroglas, Inc.
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Develops, manufactures, markets and services automatic wafer probing equipment for use in the fabrication of semiconductor devices. (Nasdaq: EGLS).
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H-Square Corporation
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Manufactures wafer handling tools, die and package pick and place tools and photomask handling tools.
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