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Williams Advanced Materials
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Precious, non precious pure metal and alloys for PVD. Lids, preforms, bonding, ribbon, cald for microelectronics, semiconductor, hybrid packages.
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WEC Technology
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Manufacturers of products that are used in the storage and transportation of IC wafers. CarbonLeaf, UltraCushion and CopperLeaf wafer separators and cushions for IC container packaging.
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Sentrex
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Manufactures films, spacers, and other materials and equipment for lamination of rigid and flexible circuit boards. Product data sheets in PDF.
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