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Other links at Electronics and Electrical > Electromechanical > Hardware > Interconnection Systems |
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CorinTech
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Micropackaging company specialising in thick film hybrids, surface mount assemblies, cob, sensors, resistor networks, ball grid arrays and thick film on steel.
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ESEC silicon packaging
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Develops system solutions and process technologies for the backend semiconductor industry. die bonder, wire bonder, assembly systems, semiconductor packaging
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Taikan
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Leading manufacturer of CATV equipment.
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CTS Corp.
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Designs, manufactures and sells passive, electromechanical, hybrid and interconnect components to OEMs. Online specifications.
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