|
Other links at Electronics and Electrical > Components > Semiconductors > Contract Manufacturing |
| 2. |
Amitec
|
|
|
Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.
|
| 3. |
WaferTech
|
|
|
Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA.
|
| 4. |
Honeywell Electronic Materials
|
|
|
Offers interconnect solutions and IC packaging specializing in on-chip semiconductor interconnects, including spin-on dielectrics and sputtering targets. Site includes product and technology briefs, and a description of company's manufacturing cleanroom.
|
| 5. |
Premier Semiconductor Services
|
|
|
Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking.
|
|
|
Add to My Favorite
Refer it to Friend
Report Broken Link
