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Other links at Electronics and Electrical > Components > Semiconductors > Contract Manufacturing |
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NS Electronics
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IC packaging and test turnkey solutions with excellent quality, cycle time and pricing.
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First Level Inc.
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Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
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AME AS
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Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing.
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Jade Precision Engineering Pte Ltd
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Singapore-based company providing lead-frame stamping, milling, plating, and taping services for semiconductors. Company history, description of services, and photos of example products.
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