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Other links at Electronics and Electrical > Components > Semiconductors > Contract Manufacturing |
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DALSA Semiconductor
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Open foundry offering specialty wafer fabrication for MEMS, high voltage CMOS, analog and mixed signal CMOS, and CCDs with experience in telecom, telephony, and optical networking chips. Company overview, facilities and manufacturing process descriptions.
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Valtronic
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Manufacturers custom miniature modules and packaging, including chip-on-board, flip chip, chip-on-chip, and multichip modules. Site include capabilites, and illustrated discussions of packaging technologies and processes.
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Advanced Thin Film Technologies
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Supplying custom coatings and patterned substrates to customers involved with microelectronics with information on coatings, patterning, capabilities, manufacturing and contacts.
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Amitec
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Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.
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