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Other links at Electronics and Electrical > Components > Semiconductors > Contract Manufacturing |
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First Level Inc.
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Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
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Walls Technology Co.
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Custom RF and microwave (wireless) product development. Requirements definition, analysis, design, prototype build and test.
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Catalyst Microtech LLC
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Semiconductor assembly and packaging services, including quick turn and turn key projects for mil-std, BGA, folded flex, and multichip packages. List of services and factory equipment and quotation form.
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