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Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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Baccini Spa
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Production of microelectronic application machines and manufacturing equipment.
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BBF Custom Products
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Manufacturer of plastic and stainless steel products for use in high purity and harsh chemical environments, including carts, holders, and cabinets. Site lists product photos and descriptions.
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Epitaxial Technologies, LLC
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Manufactures compound semiconductors and value-added wafer products for the rapidly expanding wireless and optoelectronic industries.
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Accretech Ltd.
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Specialized in the field of image processing, machine control and algorithm development for inspection tools for wafer inspection and mask inspection tools.
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