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Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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Ventex Corporation
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Provides sales, service and spare parts for Canon photolithography equipment.
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CoorsTek, Inc.
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Supplies critical components and assemblies to the semiconductor capital equipment market, including precision-machined metals, technical ceramics, and engineered plastics .
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Mattson Technology, Inc.
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Designs, manufactures and markets advanced fabrication equipment used in semiconductor manufacturing. (Nasdaq: MTSN).
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