Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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ATMI Inc.
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Manufactures point-of-use environmental equipment, thin film materials and delivery systems, and thin film deposition services to the semiconductor industry. (Nasdaq: ATMI)
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ASYS Automatic Systems GmbH
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Supplier of handling equipment for wafers, substrates, and MEMS in controlled environments. Germany. Site lists product photos and specifications in PDF format.
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