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Other links at Electronics and Electrical > Components > Semiconductors > Tools and Equipment |
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Tokyo Electron Limited (TEL)
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Manufacturer of semiconductor equipment. Information about subsidiaries, employment opportunities, training, and products.
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RD Automation Flip Chip Die bonders
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Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.
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KLA-Tencor Corporation
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Designs, manufactures, markets and services yield monitoring and process control systems for the semiconductor manufacturing industry. (Nasdaq: KLAC).
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PVA TePla AG
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Providers of microwave plasma tools for ashing, resist strip, descum, polyimide and paralyne removal, surface cleaning and isotropic etch processing for semiconductor wafers, flat panel displays , mems and optoelectronics.
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