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Other links at Electronics and Electrical > Contract Manufacturing > Printed Circuit Boards > Tools and Equipment |
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Circuit Automation
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Designs and manufactures dual-sided coating equipment for use with liquid photoimageable products.
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Applied Microtech SA
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Manufacturer of equipment for ball grid array (BGA) component handling, including removal, reballing, and alloy injection ball creation. Company also offers BGA balling and interconnection design services. France. Site includes technical FAQs on BGA placement and soldering.
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Auto MIT Co., Ltd.
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Design and construct assembly line, inspection line, aging line and buffer line for the electronic products, automated with various conveyors, work tables, equipments for exclusive use and control systems.
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Conceptronic, Inc
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Manufactures solder reflow ovens, forced convection rework stations and customized thermal processing equipment for customers in the electronics manufacturing industry.
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