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LEW Techniques
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Specialist manufacturer of miniature precision metallized ceramic and/or metal package components and packages for optoelectronic, microwave and general semiconductor devices. Includes techniques, processes and close ups of products.
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Galaxy Microsystems
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Quickturn and prototype to medium production of surface mount, mixed, or through hole printed circuit board assembly, plus testing and packaging. Site lists company capabilities.
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Benchmark Electronics
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Provider of electronics contract manufacturing services and integrated engineering design and test services. (NYSE: BHE)
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Hytel Group, Inc.
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Electronics assembly including thick film, surface mount, chip and wire, flip chip, BGAs, CSPs and electrical test. Facilities in Chicago area and Beijing, China.
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