Other links at |
1. |
LEW Techniques
|
|
Specialist manufacturer of miniature precision metallized ceramic and/or metal package components and packages for optoelectronic, microwave and general semiconductor devices. Includes techniques, processes and close ups of products.
|
3. |
Schwarz Teisnach
|
|
Manufacture of enclosures, PCBs, cables, coils and customized mechanical parts and assemblies.
|
4. |
Smc Inc.
|
|
Manufacturing of automated pin through hole and fine pitch surface mount as well as ball grid array technologies. Lexington, KY, USA.
|
5. |
NZONE
|
|
Turnkey manufacturing solutions including electrical wiring, leads and harness, printed circuit board assembly, sheet metal fabrication and production and design facilities. Short run to full scale production.
|
|
|